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| 05190 EMIF6-100FC EMI FILTER/TVS ARRAY APPLICATIONS Cellular Phones Notebooks Personal Digital Assistant (PDA) Ground Positioning System (GPS) SMART Card IEC COMPATIBILITY (EN61000-4) 61000-4-2 (ESD): Air - 15kV, Contact - 8kV 61000-4-4 (EFT): 40A - 5/50ns 15 BUMP FLIP CHIP FEATURES ESD Protection > 25 kilovolts Bidirectional EMI Filtering/TVS Low Pass Filters Low Insertion Loss: -3db Roll-Off @ 60MHz Protects Up to Six(6) Data Lines RoHS Compliant MECHANICAL CHARACTERISTICS 15 Bump Flip Chip Package Weight 0.73 milligrams (Approximate) Available in Lead-Free Plating Solder Reflow Temperature: Lead-Free - Sn/Ag/Cu, 96/3.5/0.5: 260-270C Consult Factory for Leaded Device Availability Flammability Rating UL 94V-0 8mm Tape and Reel Per EIA Standard 481 PIN CONFIGURATION For Each Line O1 O2 O3 O4 O5 O6 I/On G1 G2 G3 100 Ohm I/On 27pF GND 27pF I1 I2 I3 I4 I5 I6 05190.R8 2/07 1 www.protekdevices.com EMIF6-100FC DEVICE CHARACTERISTICS MAXIMUM RATINGS @ 25C Unless Otherwise Specified PARAMETER Operating Temperature Storage Temperature DC Power Per Resistor Typical Resistance @ 20% SYMBOL TA TSTG P R VALUE -40 to 85 -55 to 150 100 100 UNITS C C mW OHMS ELECTRICAL CHARACTERISTICS PER LINE PART NUMBER RATED STAND-OFF VOLTAGE MINIMUM BREAKDOWN VOLTAGE MAXIMUM REVERSE LEAKAGE CURRENT @3.3V ID A 0.5 @ 25C Unless Otherwise Specified MINIMUM ATTENUATION CUT-OFF FREQUENCY (50 OHMS I/O) ZERO BIAS TYPICAL CAPACITANCE PER LINE (See Note 1) @2.5V, 1MHz CLINE pF 54 TYPICAL FORWARD VOLTAGE V WM VOLTS EMIF6-100FC Note 1: 20% tolerance. 5.0 @ 1mA V(BR) VOLTS 6.0 @10mA VF VOLTS 0.8 @ 800-3000 MHz dB 30 fC MHz 60 1.100 FIGURE 1 RESISTANCE VS TEMPERATURE (Normalized to Resistance at 25C) Normalized Resistance 1.060 1.020 0.980 0.940 0.900 -40 -20 0 20 40 Temperature C 60 80 100 05190.R8 2/07 2 www.protekdevices.com EMIF6-100FC GRAPHS 0 -5 -10 -15 Gain (dB) FIGURE 2 INSERTION LOSS -20 -25 -30 -35 -40 -45 -50 0.1 1 10 100 0 Volts 2.5 Volts 1000 10000 Frequency (MHz) FIGURE 3 OVERSHOOT & CLAMPING VOLTAGE 35 5 Volts per Division 25 15 5 -5 ESD Test Pulse: +15 kilovolt, 1/30ns (waveform) FIGURE 4 OVERSHOOT & CLAMPING VOLTAGE 4 1 Volts per Division 2 0 -2 -4 ESD Test Pulse: -15 kilovolt, 1/30ns (waveform) 05190.R8 2/07 3 www.protekdevices.com EMIF6-100FC SOLDER RECOMMENDATIONS PRINTED CIRCUIT BOARD RECOMMENDATIONS PARAMETER Pad Size on PCB Pad Shape Pad Definition Solder Mask Opening Solder Stencil Thickness Solder Stencil Aperture Opening (laser cut, 5% tapered walls) Solder Paste Type Pad Protective Finish Tolerance - Edge To Corner Ball Solder Ball Side Coplanarity Maximum Dwell Time Above Liquidous (183C) Soldering Maximum Temperature VALUE 0.275mm Round Non-Solder Mask Defined Pads 0.325mm Round 0.150mm 0.330mm Round No Clean OSP(Entek Cu Plus 106A) 50m 20m 60 Seconds 270C REQUIREMENTS Temperature: TP for Lead-Free (SnAgCu): 260-270C TP for Tin-Lead: 240-245C Preheat time and temperature depends on solder paste and flux activation temperature, component size, weight, surface area & plating. RECOMMENDED NON-SOLDER MASK DEFINED PAD ILLUSTRATION Non-Solder Mask Defined Pad 0.275mm DIA. Solder Mask Opening 0.325mm DIA. Solder Stencil Opening 0.330mm DIA. TP Ramp-up Temperature - C Ramp-down TL TSMAX 155 TSMIN 140 TS - Preheat t 25C to Peak 30-60 seconds Ramp-up 15 seconds Solder Time 15-20 seconds Ramp-down 05190.R8 2/07 4 www.protekdevices.com EMIF6-100FC 15 BUMP FLIP CHIP PACKAGE OUTLINE & DIMENSIONS PACKAGE OUTLINE BOTTOM VIEW PACKAGE DIMENSIONS MILLIMETERS INCHES MIN 0.1148 0.0506 0.0195 0.0096 0.0169 0.0169 0.0071 0.0071 0.0170 0.0130 A G O G I 1 0.30 DIA. 63/67 Sn/Pb Solder Bumps C D E F H DIM SIDE VIEW MIN 2.915 1.285 0.495 0.245 0.430 0.430 0.180 0.180 0.432 0.330 MAX 3.005 1.375 0.505 0.255 0.440 0.440 0.280 0.280 0.559 0.457 MAX 0.1183 0.0541 0.0199 0.0100 0.0173 0.0173 0.0110 0.0110 0.0220 0.0180 B A B C D E F G H I J 2 3 4 5 6 I J NOTE: 1. Controlling dimensions in millimeters. SOLDER PAD LAYOUT TAPE & REEL ORDERING NOMENCLATURE 1. Surface mount product is taped and reeled in accordance with EIA-481. 2. Plastic 8mm Tape: Suffix-T73-1 = 7 Inch Reel - 3,000 pieces per reel, i.e., EMIF6-100FC-T73-1. 3. Suffix - LF = Lead-Free, i.e., EMIF6-100FC-LF-T73-1. 4. Suffix - C = Coated Version, i.e., EMIF6-100FC-T73C-1. 0.86 Non solder mask defined pad 0.275mm Solder mask opening 0.325mm Solder stencil opening 0.330mm 0.50 0.25 Outline & Dimensions: Rev 2 - 8/06, 06042 Tape & Reel Specifications (Dimensions in millimeters) Reel Dia. 178mm (7") Tape Width 8mm A0 B0 K0 D E F W P0 P2 P t 1.78 0.05 3.35 0.05 0.76 0.05 1.50 0.10 1.75 0.10 3.50 0.05 8.00 0.30 4.00 0.10 2.00 0.05 4.00 0.10 0.200.025 P0 t D P2 10 Pitches Cumulative Tolerance on Tape. 0.2 E Top cover tape A0 K0 B0 F W P User Direction of Feed COPYRIGHT (c) ProTek Devices 2007 SPECIFICATIONS: ProTek reserves the right to change the electrical and or mechanical characteristics described herein without notice (except JEDEC). DESIGN CHANGES: ProTek reserves the right to discontinue product lines without notice, and that the final judgement concerning selection and specifications is the buyer's and that in furnishing engineering and technical assistance, ProTek assumes no responsibility with respect to the selection or specifications of such products. ProTek Devices 2929 South Fair Lane, Tempe, AZ 85282 Tel: 602-431-8101 Fax: 602-431-2288 E-Mail: sales@protekdevices.com Web Site: www.protekdevices.com 05190.R8 2/07 5 www.protekdevices.com |
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